Inductor and coil substrate

摘要

An inductor includes a stacked structure. The stacked structure includes a substrate, a first structural body stacked on a lower surface of the substrate, and second structural bodies sequentially stacked on an upper surface of the substrate. A through hole extends through the stacked structure in a thickness direction. An insulation film covers the stacked structure. The first structural body includes a first insulating layer stacked on the lower surface of the substrate, and a first wiring stacked on a lower surface of the first insulating layer. The second structural bodies include second insulating layers and second wirings. The first wiring and the second wirings are connected in series to one another to form a helical coil. The substrate has a thickness greater than that of the first insulating layer and the second insulating layers.

主权项

1. An inductor comprising:
a stacked structure including a substrate, a first structural body stacked on a lower surface of the substrate, and a plurality of second structural bodies sequentially stacked on an upper surface of the substrate; a through hole extending through the stacked structure in a thickness direction; and an insulation film covering the stacked structure, wherein: the first structural body includes a first insulating layer, which is stacked on the lower surface of the substrate, and a first wiring, which is stacked on a lower surface of the first insulating layer; the first wiring is positioned at a lowermost layer of the stacked structure; the plurality of second structural bodies include a plurality of second insulating layers and a plurality of second wirings, respectively; one of the second insulating layers is positioned at an uppermost layer of the stacked structure; each of the second insulating layers is stacked on an upper surface of a corresponding one of the second wirings; an inner surface of the substrate, an inner surface of the first structural body, and inner surfaces of the second structural bodies define an inner wall surface of the through hole; the first wiring includes a first connection portion; the second wiring of the uppermost one of the second structural bodies includes a second connection portion; the insulation film covers the stacked structure except for a surface of the stacked structure on which the first connection portion and the second connection portion are exposed; the first wiring and the second wirings are connected in series to one another to form a helical coil; and the substrate has a thickness greater than that of the first insulating layer and greater than that of each of the second insulating layers.