Semiconductor package

摘要

A semiconductor package is provided. The semiconductor package includes a substrate, a first pad, a second, a first conductive element, a surface mount device, a first bonding wire and a molding compound layer. The first pad, the second pad, and the first conductive element are formed on the substrate. The surface mount device is mounted on the first pad and the second pad. The first bonding wire electrically connects the first conductive element and the first pad. The molding compound layer encapsulates the substrate, the first pad, the second pad, the first conductive element, the bonding wire and the surface mount device.

主权项

1. A semiconductor package, comprising:
a substrate; a first pad formed on the substrate; a second pad formed on the substrate; a first conductive element formed on the substrate; a surface mount device mounted on the first pad and the second pad; a first bonding wire electrically connecting a first bonding area of the first conductive element and a second bonding area of the first pad; a second conductive element formed on the substrate, and formed between the first pad and the first conductive element; a solder resistance layer, covering a portion of the first bonding area and a portion of the second bonding area; a molding compound layer encapsulating the substrate, the first pad, the second pad, the first conductive element, the second conductive element, the bonding wire and the surface mount device.