| 摘要 |
The present invention provides a grinding apparatus capable of grinding a plate-shaped workpiece to an expected thickness by accurately measuring the thickness of the plate-shaped workpiece in a grinding process and capable of preventing occurrence of insufficient grinding or over grinding. A thickness calculating part (53) calculates the thickness of the plate-shaped workpice according to a light path length difference of lights reflected from an upper surface and a lower surface of the plate-shaped workpiece, and a radiation thermometer (541) measures the temperature of the plate-shaped workpiece by receiving an infrared light radiated from the plate-shaped workpiece, a temperature storing part (542) stores the temperature measured by the radiation thermometer (541). A thickness correcting part (55) calculates a refractive index of the plate-shaped workpiece based on the temperature stored by the temperature storing part (542), and corrects the thickness calculated by the thickness calculating part (53) based on the calculated refractive index. In this way, the plate-shaped workpiece can be grinded to the expected thickness as the thickness of the plate-shaped workpiece is measured and corrected while the plate-shaped workpiece is grinded. |
