Chip to package interface

摘要

In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip disposed within an encapsulant, and a first coil disposed in the semiconductor chip. A dielectric layer is disposed above the encapsulant and the semiconductor chip. A second coil is disposed above the dielectric layer. The first coil is magnetically coupled to the second coil.

主权项

1. A method of forming a semiconductor package comprising:
providing a semiconductor chip comprising a first coil; forming a reconstituted wafer by encapsulating the semiconductor chip with an encapsulant; forming a dielectric layer above the encapsulant and the semiconductor chip; forming a second coil disposed above the dielectric layer, the first coil being magnetically coupled to the second coil; and forming a metal line electrically coupled to the first coil in the semiconductor chip, the metal line being magnetically coupled to the second coil.