| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor testing device that enables electrical testing of a semiconductor element sensitive to stress in s substrate state prior to cutting of the substrate to pieces.SOLUTION: Grooves are formed on a loading platform of a semiconductor testing device and are configured to be able to communicate with a vacuum pump. The groove is plurally formed corresponding to each of a plurality of substrates different in a profile, and when the substrate adhered on an adhesion tape is loaded on the loading platform, only one groove is configured to be selected from the plurality of grooves in accordance with the profile of the substrate. Accordingly, only a part of the adhesion tape in the vicinity of a substrate peripheral edge is fixedly suctioned, which in turn it is unnecessary to exert an excessive force to the semiconductor element.</p> |
