| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board chemical treatment device and a wiring board chemical treatment method capable of performing chemical treatment in an even state compared with conventional ones, to a wiring board.SOLUTION: A wiring board chemical treatment device 10 of the invention is configured so that: piping connection parts 29 are disposed on plural positions of each suction duct 20 in a longitudinal direction and to which pipings 35 for suction extending from a venturi pump 32 are connected, so that difference of suction force according to positions on the suction ducts 20 in the longitudinal direction is relaxed. Therefore a chemical agent liquid can be newly sprayed from an injection nozzle 14 to a portion where the chemical agent liquid is removed from the wiring board 90 by the suction ducts 20 in an even state compared with a conventional device, and chemical treatment using the chemical agent liquid to the wiring board 90 can be performed in an even state compared with conventional treatment.</p> |
