| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can obtain good thermal and mechanical connection to a cooler.SOLUTION: A semiconductor device comprises: a base plate 1 having a mounting surface SM on which a semiconductor element 4 is mounted and a radiation surface SR for radiating heat to a cooler; and a coating part 110 has a part for encapsulating the semiconductor element 4 on the mounting surface SM of the base plate 1. The coating part 110 has a projection part 110P which is arranged on the outside of the radiation surface SR and projects from the radiation surface SR in a thickness direction DT. An intermediate part 200 is provided on the radiation surface SR of the base plate 1 and projects farther than the projection part 110P of the coating part 110 in the thickness direction DT and which is composed of a solid-phase thermoplastic material. |
