发明名称 PRODUCTION METHOD OF SUBSTRATE-ATTACHED VAPOR DEPOSITION MASK DEVICE, SUBSTRATE-ATTACHED VAPOR DEPOSITION MASK AND RESIST PATTERN-ATTACHED SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a production method of a substrate-attached vapor deposition mask device capable of imparting a tension having a proper value to a vapor deposition mask, and suppressing an influence of a shadow without thinning a film thickness.SOLUTION: A production method of a substrate-attached vapor deposition mask device includes the steps for: forming a resist pattern 3 for plating treatment on the substrate 1; and forming a vapor deposition mask 2, by subjecting the resist pattern 3 to the plating treatment as a mask. A cross section of the resist pattern 3 has a tapered shape tapered toward the substrate 1.</p>
申请公布号 JP2015168848(A) 申请公布日期 2015.09.28
申请号 JP20140044270 申请日期 2014.03.06
申请人 DAINIPPON PRINTING CO LTD 发明人 SEKI KENTARO;SHIMAZAKI HIROSHI;OKUDA TORU;SAKATA HIROKI;MIYAZAKI SUSUMU
分类号 C23C14/04;H01L51/50;H05B33/10 主分类号 C23C14/04
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