发明名称 COMPOSITE WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a composite wiring board having high production efficiency and a manufacturing method of the same.SOLUTION: By plastically deforming a metal frame 30G in a facing state where two printed wiring boards 10 are overlapped and disposed in one opening 30, respective side walls of the two printed wiring boards 10 and a side wall of an opening 30 of the metal frame 30G are joined. Therefore, since steps of filling and curing of an adhesive agent become unnecessary, production efficiency is enhanced and joining of the printed wiring boards 10 to the metal frame 30G at a low price becomes possible.</p>
申请公布号 JP2015170636(A) 申请公布日期 2015.09.28
申请号 JP20140042540 申请日期 2014.03.05
申请人 IBIDEN CO LTD 发明人 ISHIHARA TERUYUKI;TAKAHASHI MICHIMASA
分类号 H05K3/00;H05K3/34 主分类号 H05K3/00
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