| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate poor connection of an electrode terminal by preventing warping of an electronic component.SOLUTION: In a method of manufacturing a connection body, an electronic component which has bumps separately provided on one side of paired opposed side edges and the another side thereof, is arranged on a circuit board via an adhesive film, and pressure-bonded to the circuit board by a pressure-bonding tool. The adhesive film causes hardening reaction in an area where a section between the bumps of the electronic component is prearranged, before the electronic component is pressure-bonded by the pressure-bonding tool.</p> |
