| 摘要 |
PROBLEM TO BE SOLVED: To provide: an underfill material which has an adequate hardening reactivity, is small in change in viscosity even when the load of a heat hysteresis is put thereon, and enables the achievement of good electrical connection; a laminate sheet including such an underfill material; and a method for manufacturing a semiconductor device.SOLUTION: An underfill material has a melt viscosity of 50-3000 Pa s at 150°C before heat treatment, the melt viscosity having the rate of viscosity change represented by (&eegr;2/&eegr;1)×100 being 500% or less, where &eegr;1 represents the melt viscosity at 150°C before heat treatment, and &eegr;2 represents a melt viscosity at 150°C after heat treatment at 130°C for one hour. In the underfill material, a reaction rate expressed by {(Qt-Qh)/Qt}×100 is 90% or more, where Qt represents a total quantity of heat generation in the step of raising the temperature from -50 to 300°C in DSC measurement, and Qh represents a total quantity of heat generation in the step for raising the temperature from -50 to 300°C after heating at 175°C for two hours. |
