发明名称 PROCESSING METHOD OF PLATE-LIKE OBJECT
摘要 PROBLEM TO BE SOLVED: To provide a processing method of a plate-like object capable of removing a laminate and expose a substrate without damaging the substrate of a plate-like object composed of the substrate and the laminate formed on a surface of the substrate.SOLUTION: The processing method of a plate-like object for processing a plate-like object composed of a substrate and a laminate formed on a surface of the substrate includes: irradiating a region from which a plate-like object laminate is preferred to be removed with a laser beam whose energy density is so set as to destroy the laminate but not to destroy the substrate; and performing a substrate exposure step for removing the laminate and expose the substrate.
申请公布号 JP2015170675(A) 申请公布日期 2015.09.28
申请号 JP20140043486 申请日期 2014.03.06
申请人 DISCO ABRASIVE SYST LTD 发明人 OGAWA YUKI;ISHIDA YUKI;OBATA TSUBASA
分类号 H01L21/301;B23K26/36 主分类号 H01L21/301
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