摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a plate-like object capable of removing a laminate and expose a substrate without damaging the substrate of a plate-like object composed of the substrate and the laminate formed on a surface of the substrate.SOLUTION: The processing method of a plate-like object for processing a plate-like object composed of a substrate and a laminate formed on a surface of the substrate includes: irradiating a region from which a plate-like object laminate is preferred to be removed with a laser beam whose energy density is so set as to destroy the laminate but not to destroy the substrate; and performing a substrate exposure step for removing the laminate and expose the substrate. |