METHOD OF MANUFACTURING BUMP ELECTRODE AND SUBSTRATE FOR FORMING BUMP ELECTRODE

摘要

PROBLEM TO BE SOLVED: To manufacture a bump electrode having high bonding reliability by preventing generation of voids due to remaining of air bubbles in the vicinity of an interface of a base metal layer.SOLUTION: A method of manufacturing a bump electrode comprises: a plating step of forming, in an opening of a resist layer on a substrate, a solder plating layer in a laminated manner on a surface of a metal layer exposed in the opening by electrolytic plating; a resist layer removal step of removing the resist layer after the plating step; an etching step of forming a base metal layer having an outer diameter smaller than that of the solder plating layer by etching the metal layer after removal of the resist layer; and a reflow treatment step of melting the solder plating layer above the base metal layer to form a solder bump on the base metal layer.