发明名称 WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board in which electrical reliability when a plurality of electronic components are arranged inside one through hole is improved; and provide a manufacturing method of the wiring board.SOLUTION: A wiring board comprises: a core layer in which a through hole is formed and which has projections projecting from an inner wall of the through hole to the inside of the through hole in planar view; a plurality of electronic components which are stored inside the through hole in a state of being separated from each other and next to each other, with side parts in an arrangement direction are engaged with the projections; and a resin layer which is filled inside the through hole and holds at least lateral faces of the electronic components.
申请公布号 JP2015170670(A) 申请公布日期 2015.09.28
申请号 JP20140043318 申请日期 2014.03.05
申请人 SHINKO ELECTRIC IND CO LTD 发明人 KUSAMA YASUHIKO;TAMITSU HIDEYUKI;KAWAI KENJI;MIYASAKA FUMIHISA
分类号 H05K1/18 主分类号 H05K1/18
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