发明名称 |
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which electrical reliability when a plurality of electronic components are arranged inside one through hole is improved; and provide a manufacturing method of the wiring board.SOLUTION: A wiring board comprises: a core layer in which a through hole is formed and which has projections projecting from an inner wall of the through hole to the inside of the through hole in planar view; a plurality of electronic components which are stored inside the through hole in a state of being separated from each other and next to each other, with side parts in an arrangement direction are engaged with the projections; and a resin layer which is filled inside the through hole and holds at least lateral faces of the electronic components. |
申请公布号 |
JP2015170670(A) |
申请公布日期 |
2015.09.28 |
申请号 |
JP20140043318 |
申请日期 |
2014.03.05 |
申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
KUSAMA YASUHIKO;TAMITSU HIDEYUKI;KAWAI KENJI;MIYASAKA FUMIHISA |
分类号 |
H05K1/18 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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