| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to suck and hold a substrate up to a neighborhood of a circumference of the substrate, suppress weight increase of a substrate holding part 6, and perform highly uniform liquid processing by suppressing warpage of a thin wafer W when liquid-processing the substrate by sucking and holding the substrate horizontally at a substrate holding part 6 rotatable by a rotation mechanism and forming a liquid film of process liquid on the surface of the substrate.SOLUTION: A substrate holding part 6 has a configuration in which an annular holding member 61 whose density is smaller than density of a spin chuck 21 is detachably provided by screwing so as to surrounding the spin chuck connected to a shaft 23, and holds a thin wafer W horizontally by providing a porous material placement plate 62 over a surface of the spin chuck 21 and a surface of the holding member 61. |
