发明名称 COVER FOR HIGH FREQUENCY CIRCUIT CASE
摘要 <p>PROBLEM TO BE SOLVED: To solve such problems of a case for housing a high frequency circuit that since a radio wave absorber is provided on a cover in order to prevent internal resonance, and unnecessary radiation of radio waves to the outside, an expensive metal film capable of soldering or brazing the cover to the radio wave absorber is required, and that the radio wave absorber is susceptible to cracking due to the difference of linear expansion between the cover and the radio wave absorber, because of strong bonding by solder or brazing material.SOLUTION: A radio wave absorber is secured to a cover by means of a metal band that is bonded to the cover by solid phase bonding or welding.</p>
申请公布号 JP2015170834(A) 申请公布日期 2015.09.28
申请号 JP20140047277 申请日期 2014.03.11
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMAGUCHI KAZUHIRO
分类号 H05K9/00 主分类号 H05K9/00
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