ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide an electronic device whose height can be lowered, and to provide a manufacturing method of the electronic device.SOLUTION: An electronic device 100 includes: a mounting board 10; a SAW chip 12 mounted on the mounting board 10; and a sealing part 34 including a metal lid 32 located at least on the SAW chip and consisting of plating and solder 30 formed on the mounting board 10 so as to surround the SAW chip 12 in contact with the metal lid 32 to seal the SAW chip 12. Since the metal lid 32 located on the SAW chip 12 consists of plating, the thickness of the metal lid 32 can be thinned and the height of the electronic device 100 can be lowered.