| 摘要 |
PROBLEM TO BE SOLVED: To provide a package structure that includes a first dielectric layer, a semiconductor device attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein.SOLUTION: Vias are formed through the first dielectric layer to the semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on outward facing surfaces of the package structure to enable a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicularly to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit. |
