| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent cracking or peeling of a conductive bonding material, by relaxing a stress applied to the conductive bonding material used for bonding to a mounting board.SOLUTION: A mounting structure of a piezoelectric device includes a package body 2 internally housing a piezoelectric element, and a plurality of external terminals 23A, 23B on the bottom surface, and a plurality of metal chips 6 provided between the package body 2 and a mounting board 100 along with the external terminals, and each having a first principal surface S1 being bonded to the external terminal, and a second principal surface S2 being bonded to any one of the plurality of terminal bonding pads (100A, and the like) provided on the mounting board 100.</p> |
