| 摘要 |
FIELD: chemistry.SUBSTANCE: invention relates to instrument-making and radio electronic industry and can be used in conditions where there is need for a top coat on a high-planarity printed-circuit board or longer period of preserving the capacity for soldering, or corrosion protection of articles made of copper and copper alloys using tin-containing coatings, or as a resistive coating in copper and copper alloy etching processes. The aqueous solution for chemical deposition of tin coatings on a copper or copper alloy surface has components in the following ratio, g/l: tin dichloride dihydrate - 2-20, thiourea - 5-85, sulphuric acid - 5-75, fluorides - 0.1-100. The solution may contain ammonium fluorides and alkali or alkali-earth metal fluorides.EFFECT: invention enables to obtain coatings on a copper or copper alloy surface, having improved appearance, physical-chemical and functional properties.4 cl |
