BASE MATERIAL PARTICLE, CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

摘要

Provided is a base material particle that, when electrically connecting electrodes using conductive particles having a conductive layer formed at the surface thereof, can reduce connection resistance and can suppress connection defects resulting from spring back and connection defects resulting from the occurrence of cracks in the electrodes. The base material particle (11) has a conductive layer (2) formed at the surface thereof and is used for obtaining conductive particles (1) having a conductive layer (2). The base material particle (11) is a core-shell particle provided with a core (12) and a shell (13) disposed on the surface of the core (12). The compression recovery rate of the base material particle (11) is less than 50%. The compression modulus of elasticity of the base material particle (11) when compressed by 10% is at least 3000 N/mm2 and less than 6000 N/mm2. The ratio of the load value when the base material particle (1) is compressed by 30% with respect to the load value when compressed by 10% is no greater than 3.