ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD

摘要

A component mounting unit includes first and second board conveyance mechanisms, first and second component supply units, and first and second component mounting mechanisms, for performing a component mounting work on a front surface and a rear surface of boards of a same type in parallel. Electronic components of all kinds to be mounted on the front surface and the rear surface at the component mounting unit are distributed to the first and second component supply units. The first and second component mounting mechanisms pick up electronic components from the first and second component supply unit, respectively. The first component mounting mechanism mounts the electronic component on the board held by each of the first and second board conveyance mechanisms. The second component mounting mechanism mounts the electronic component on the board held by each of the first and second board conveyance mechanisms.

主权项

1. An electronic component mounting system for performing a component mounting work on a front surface and a rear surface of boards of a same type in parallel, said electronic component mounting system comprising:
a component mounting line formed by connecting a plurality of component mounting units that perform the component mounting work to mount an electronic component on a board, wherein at least one of the component mounting units comprising:
a first board conveyance mechanism and a second board conveyance mechanism, each comprising a board holding unit which conveys a board delivered from an upstream side device in a board conveyance direction and which positions and holds the board;a first component supply unit and a second component supply unit provided to correspond to the first board conveyance mechanism and the second board conveyance mechanism, respectively; anda first component mounting mechanism and a second component mounting mechanism which are provided to correspond to the first board conveyance mechanism and the second board conveyance mechanism, respectively, which pick up electronic components supplied by the first component supply unit and the second component supply unit, respectively, and mounting the electronic components on the board held by the board holding unit, wherein electronic components of all kinds to be mounted on the front surface and the rear surface at the own component mounting unit are distributed to the first component supply unit and the second component supply unit, wherein the first component mounting mechanism picks up an electronic component from the first component supply unit, and mounts the electronic component on the board held by the board holding unit of each of the first board conveyance mechanism and the second board conveyance mechanism, and wherein the second component mounting mechanism picks up an electronic component from the second component supply unit, and mounts the electronic component on the board held by the board holding unit of each of the first board conveyance mechanism and the second board conveyance mechanism.