SUBSTRATE PROCESSING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND COMPUTER-READABLE RECORDING MEDIUM

摘要

Provided is a substrate processing apparatus, including: a processing space configured to process a substrate: an exhaust buffer chamber which is provided so as to surround a lateral circumference of the processing space and into which a gas supplied into the processing space is flowed; and a conductance adjustment plate disposed to face a gas flow path between the processing space and the exhaust buffer chamber, wherein the conductance adjustment plate has R-shaped portion or a tapered inclined portion on an inner peripheral side edge facing the gas flow path from the processing space to the exhaust buffer chamber.

主权项

1. A substrate processing apparatus, comprising:
a processing space configured to process a substrate: a substrate mounting table configured to mount the substrate thereon; an elevation mechanism configured to elevate the substrate between a transport position and a substrate processing position in the processing space by elevating the substrate mounting table; a gas supply system configured to supply a gas into the processing space; an exhaust buffer chamber having a space provided so as to surround a lateral circumference of the processing space, and configured to allow a gas to flow therein, the gas being supplied into the processing space; a gas exhaust system configured to exhaust the gas flowed into the exhaust buffer chamber; and a conductance adjustment plate disposed on an outer peripheral side of the substrate, wherein the conductance adjustment plate is formed in a state that an inner peripheral side is supported by the substrate mounting table when the substrate is positioned at the substrate processing position, and in a state that an outer peripheral side is supported by a part other than the substrate mounting table when the substrate is positioned at the transport position, and has a tapered inclined portion or an R-shaped portion on an inner peripheral side edge facing a gas flow path from the processing space to the exhaust buffer chamber.