| 摘要 |
The invention relates to an optoelectronic component (10) having a carrier (12), on which a first electrode (20) is formed. Atop the first electrode (20), an optically functional layer structure (22) is formed. Atop the optically functional layer structure (22), a second electrode (23) is formed extending in a planar manner across at least part of the side of the optically functional layer structure (22) that is facing away from the carrier (12). Atop the first and/or second electrode (20, 23), an encapsulation is formed, which encloses the optically functional layer structure (22). An electrically conductive contact structure (40) is arranged in a recess of the encapsulation on the first and/or the second electrode (20, 23) and extends through the encapsulation, for electrically contacting the first and/or second electrode (20, 23). The contact structure (40) and the encapsulation are configured such that the contact structure (40) and the encapsulation act together to encapsulate the first and/or the second electrode (20, 23). |
