| 摘要 |
This anisotropic conductive film has an insulating binder layer, conductive particles arranged in a regular pattern on one surface of the insulating binder layer, and an insulating adhesive layer which is laminated on one surface of the insulating binder layer. On the insulating binder layer of the anisotropic conductive film, an insulating filler is arranged in a regular pattern that does not overlap with the conductive particles. This anisotropic conductive film can be manufactured by arranging the conductive particles and insulating filler in regular patterns using a transfer mold that has an opening, and during anisotropic conductive connection, it is possible to largely avoid short circuits by avoiding connection of the conductive particles, without increasing the connection resistance. |
