| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a processing method that allows a die attach film (DAF) to be surely divided corresponding to individual devices.SOLUTION: The processing method that divides a DAF adhered to a backside of a wafer, on a surface of which a plurality of devices are formed by being partitioned by scheduled division lines formed in a lattice shape, corresponding to the individual devices, performs: a wafer preparing step of preparing a wafer having a modified layer formed inside the wafer along the scheduled division lines or a wafer divided into the individual devices along the scheduled division lines; a wafer arranging step of positioning the wafer prepared in the wafer preparing step at an annular frame having an opening portion for storing the wafer and arranging a backside of the wafer at an expand tape while interposing the DAF therebetween; and a DAF dividing step of expanding the expand tape and applying tensile force to the wafer through the DAF after the wafer arranging step so as to widen an interval between adjacent devices and divide the DAF corresponding to the devices, where the DAF is softened by heating the DAF up to a predetermined temperature in the DAF dividing step.</p> |
