PHOTOSENSITIVE RESIN COMPOSITION, CURED-RELIEF-PATTERN PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE

摘要

This photosensitive resin composition includes: (A) at least one resin selected from the group consisting of polyamic acids which are polyimide precursors, polyamic acid esters, polyamic acid salts, polyamic acid amides, polyhydroxyamides which are capable of becoming polyoxazole precursors, polyaminoamides, polyamides, polyamideimides, polyimides, polybenzoxazoles, polybenzimidazoles, polybenzothiazoles, and phenolic resins; (B) a photosensitive agent; and (C) at least one selected from the group consisting of polyfunctional (meth)acrylates, and low-molecular-weight imide compounds having a molecular weight of less than 1000.