CERAMIC WIRING BOARD AND SEMICONDUCTOR DEVICE

摘要

[Problem] To provide a ceramic wiring board having a high degree of reliability with low susceptibility to cracking due to heat load and temperature cycles and peeling of a metalization layer and a solder layer, and to provide a semiconductor device. [Solution] In the present invention, a ceramic wiring board is obtained by filling an up/down conduction hole formed through a ceramic board in the direction of thickness thereof with an up/down conductor comprising a composite material containing at least one low resistance metal selected from the group consisting of Cu, Ag, and Au, and at least one high melting point metal selected from the group consisting of W and Mo, the residual stress being 100 MPa or less. In a semiconductor device of the present invention, a semiconductor element is installed on the ceramic wiring board.