| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of obtaining excellent electrical connection to a circuit board by inhibiting cracks in a solder bump from being generated.SOLUTION: In a semiconductor device in which a plurality of columnar electrodes 16 and a sealing layer 17 are provided on the upper surface side of a semiconductor substrate 11, and the upper surface of each columnar electrode 16 is exposed on the upper surface of the sealing layer 17, an insulative guide layer 19 is provided on the upper surface of the sealing layer 17 and individually connected to each columnar electrode 16, and a plurality of electrodes 18 for external connection whose upper part protrudes from the upper surface of the guide layer 19 are provided. Here, the upper parts of the external connection electrodes 18 are provided so as not to protrude above the guide layer 19 covering the peripheral side surface of the external connection electrodes 18. |
