METHOD FOR MANUFACTURING WIRING BOARD WITH CONDUCTIVE POST

摘要

A method for manufacturing a wiring board having conductive posts includes preparing a wiring board including electronic circuit and a solder resist layer covering the electronic circuit and having first openings and second openings surrounding the first openings such that the first openings are exposing pad portions of the electronic circuit and that the second openings are exposing post connecting portions of the electronic circuit surrounding the pad portions, applying surface treatment to the pad portions, forming a plating resist layer on the wiring board after the surface treatment of the pad portions such that the plating resist layer has resist openings exposing the post connecting portions, applying electrolytic plating on the post connecting portions such that conductive posts rising from the post connecting portions are formed in the resist openings, and removing the plating resist layer from the wiring board after forming the conductive posts in the resist openings.

主权项

1. A method for manufacturing a wiring board having conductive posts, comprising:
preparing a wiring board comprising an electronic circuit and a solder resist layer covering the electronic circuit and having a plurality of first opening portions and a plurality of second opening portions surrounding the plurality of first opening portions such that the plurality of first opening portions is exposing a plurality of pad portions of the electronic circuit, respectively, and that the plurality of second opening portions is exposing a plurality of post connecting portions of the electronic circuit surrounding the pad portions, respectively; applying a surface treatment to the plurality of pad portions; forming a plating resist layer on the wiring board after the surface treatment of the pad portions such that the plating resist layer has a plurality of resist opening portions exposing the plurality of post connecting portions, respectively; applying electrolytic plating on the plurality of post connecting portions such that a plurality of conductive posts rising from the plurality of post connecting portions is formed in the plurality of resist opening portions, respectively; and removing the plating resist layer from the wiring board after forming the plurality of conductive posts in the plurality of resist opening portions.