发明名称 ABRUPT SOURCE/DRAIN JUNCTION FORMATION USING A DIFFUSION FACILITATION LAYER
摘要 A method of forming a field effect transistor (FET) device includes forming a diffusion facilitation layer on top of a semiconductor substrate; forming a doped, raised source/drain (RSD) layer on the diffusion facilitation layer; removing a portion of the diffusion facilitation layer, corresponding to a region directly above a channel region of the FET device; and performing an anneal so as to define abrupt source and drain junctions in the semiconductor substrate, wherein dopant atoms from the doped RSD layer diffuse within the diffusion facilitation layer at a faster rate than with respect to the semiconductor substrate.
申请公布号 US2015270343(A1) 申请公布日期 2015.09.24
申请号 US201514697024 申请日期 2015.04.27
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 Cheng Kangguo;Doris Bruce B.;Hashemi Pouya;Khakifirooz Ali;Reznicek Alexander
分类号 H01L29/08;H01L29/167;H01L27/092;H01L29/165 主分类号 H01L29/08
代理机构 代理人
主权项 1. A field effect transistor (FET) device, comprising: a diffusion facilitation layer formed on top of a semiconductor substrate; a doped, raised source/drain (RSD) layer formed on the diffusion facilitation layer; the diffusion facilitation layer having a portion thereof removed, corresponding to a region directly above a channel region of the FET device; and abrupt source and drain junctions defined in the semiconductor substrate, wherein the diffusion facilitation layer and the semiconductor substrate comprise materials such that dopant atoms from the doped RSD layer diffuse within the diffusion facilitation layer at a faster rate than with respect to the semiconductor substrate.
地址 Armonk NY US
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