Curved Wafer Processing Method and Apparatus

摘要

An apparatus for and a method of forming a semiconductor structure is provided. The apparatus includes a substrate holder that maintains a substrate such that the processing surface is curved, such as a convex or a concave shape. The substrate is held in place using point contacts, a plurality of continuous contacts extending partially around the substrate, and/or a continuous ring extending completely around the substrate. The processing may include, for example, forming source/drain regions, channel regions, silicides, stress memorization layers, or the like.

主权项

1. A substrate holder comprising:
one or more wafer support surfaces, the one or more wafer support surfaces collectively being non-planar; and one or more connectors configured to hold a wafer on the wafer support surfaces.