发明名称 |
STACKED DIE INTEGRATED CIRCUIT |
摘要 |
An apparatus relates generally to an integrated circuit package. In such an apparatus, a package substrate has a first plurality of via structures extending from a lower surface of the package substrate to an upper surface of the package substrate. An die has a second plurality of via structures extending to a lower surface of the die. The lower surface of the die faces the upper surface of the package substrate in the integrated circuit package. The package substrate does not include a redistribution layer. The die and the package substrate are coupled to one another. |
申请公布号 |
WO2015143023(A1) |
申请公布日期 |
2015.09.24 |
申请号 |
WO2015US21224 |
申请日期 |
2015.03.18 |
申请人 |
INVENSAS CORPORATION |
发明人 |
WOYCHIK, CHARLES G.;UZOH, CYPRIAN EMEKA;ZHANG, RON;BUCKMINSTER, DANIEL;GAO, GUILIAN |
分类号 |
H01L25/065;H01L23/498 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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