| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an extrusion T-die apparatus related to a coextrusion T-die of a single manifold-beak system, capable of setting an appropriate condition at a short time through quickly changing a molding condition and a manufacturing condition for highly accurate and uniform film production even with a multilayer film configuration, while reducing the amount of use resin, and allowing continuous and stable manufacture.SOLUTION: An coextrusion T-die apparatus of a single manifold-beak system includes: a thickness sensor configured to measure the thickness of a resin extruded from a T-die; and at least one piezoelectric element arranged in a longer direction of a lip opening of the T-die. Voltage is applied to the piezoelectric element so that the thickness of the resin measured by the thickness sensor becomes a desired thickness, and the piezoelectric element is deformed in a thickness direction to adjust the lip width.</p> |
