发明名称 リガンド固定化用基材及びその製造方法
摘要 <p>The present invention provides a substrate for ligand support in which a copolymer represented by the following formula (1) is bonded to at least a surface of a water-insoluble carrier: [in the formula (1), n and m represent a positive integer, and a value of m / (n + m) is greater than or equal to 0.1 and less than or equal to 0.45, R 1 represents H or CH 3 , R 2 represents an organic group including an electrophilic functional group, and R 3 represents</p>
申请公布号 JP5784008(B2) 申请公布日期 2015.09.24
申请号 JP20120509465 申请日期 2011.03.28
申请人 发明人
分类号 B01J20/24;A61K35/14;A61M1/36;A61P7/00;B01J20/22;B01J20/28;C08F220/10;C08F220/34 主分类号 B01J20/24
代理机构 代理人
主权项
地址