发明名称 |
MAGNETIC CORE AND PROCESS FOR PRODUCING SAME |
摘要 |
The present invention provides a magnetic core which can be produced with improved productivity without increasing a material cost and has required magnetic and mechanical properties and a process for producing the same. The magnetic core is produced by compression molding and thereafter thermally hardening iron-based soft magnetic powder having resin films formed on surfaces of particles thereof. The resin film is an uncured resin film formed by dry mixing the iron-based soft magnetic powder and epoxy resin containing a latent curing agent with each other at a temperature not less than a softening temperature of the epoxy resin and less than a thermal curing starting temperature thereof. The iron-based soft magnetic powder having the resin films formed on the surfaces of the particles thereof is compression molded by using a die to produce a compression molded body. The compression molded body having the resin films formed on the surfaces of the particles thereof is thermally hardened at a temperature not less than the thermal curing starting temperature of the epoxy resin. |
申请公布号 |
US2015270050(A1) |
申请公布日期 |
2015.09.24 |
申请号 |
US201314433002 |
申请日期 |
2013.09.27 |
申请人 |
NTN CORPORATION |
发明人 |
Uemoto Ikuo;Miyazaki Shinji;Harano Takuji;Mori Natsuhiko;Noda Hiroyuki |
分类号 |
H01F27/255;H01F1/22;H01F41/02 |
主分类号 |
H01F27/255 |
代理机构 |
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代理人 |
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主权项 |
1. A magnetic core produced by compression molding and thereafter thermally hardening iron-based soft magnetic powder having resin films formed on surfaces of particles thereof,
wherein said resin film is an uncured resin film formed by dry mixing said iron-based soft magnetic powder and epoxy resin containing a latent curing agent with each other at a temperature not less than a softening temperature of said epoxy resin and less than a thermal curing starting temperature thereof; said iron-based soft magnetic powder having said resin films formed on said surfaces of said particles thereof is compression molded by using a die to produce a compression molded body; and said compression molded body having said resin films formed on said surfaces of said particles thereof is thermally hardened at a temperature not less than said thermal curing starting temperature of said epoxy resin. |
地址 |
Osaka-shi JP |