发明名称 MAGNETIC CORE AND PROCESS FOR PRODUCING SAME
摘要 The present invention provides a magnetic core which can be produced with improved productivity without increasing a material cost and has required magnetic and mechanical properties and a process for producing the same. The magnetic core is produced by compression molding and thereafter thermally hardening iron-based soft magnetic powder having resin films formed on surfaces of particles thereof. The resin film is an uncured resin film formed by dry mixing the iron-based soft magnetic powder and epoxy resin containing a latent curing agent with each other at a temperature not less than a softening temperature of the epoxy resin and less than a thermal curing starting temperature thereof. The iron-based soft magnetic powder having the resin films formed on the surfaces of the particles thereof is compression molded by using a die to produce a compression molded body. The compression molded body having the resin films formed on the surfaces of the particles thereof is thermally hardened at a temperature not less than the thermal curing starting temperature of the epoxy resin.
申请公布号 US2015270050(A1) 申请公布日期 2015.09.24
申请号 US201314433002 申请日期 2013.09.27
申请人 NTN CORPORATION 发明人 Uemoto Ikuo;Miyazaki Shinji;Harano Takuji;Mori Natsuhiko;Noda Hiroyuki
分类号 H01F27/255;H01F1/22;H01F41/02 主分类号 H01F27/255
代理机构 代理人
主权项 1. A magnetic core produced by compression molding and thereafter thermally hardening iron-based soft magnetic powder having resin films formed on surfaces of particles thereof, wherein said resin film is an uncured resin film formed by dry mixing said iron-based soft magnetic powder and epoxy resin containing a latent curing agent with each other at a temperature not less than a softening temperature of said epoxy resin and less than a thermal curing starting temperature thereof; said iron-based soft magnetic powder having said resin films formed on said surfaces of said particles thereof is compression molded by using a die to produce a compression molded body; and said compression molded body having said resin films formed on said surfaces of said particles thereof is thermally hardened at a temperature not less than said thermal curing starting temperature of said epoxy resin.
地址 Osaka-shi JP