发明名称 METHOD FOR MANUFACTURING CONNECTION STRUCTURE, AND CIRCUIT CONNECTING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a connection structure that can maintain a service life and allows low-temperature press-bonding, and a circuit connecting material.SOLUTION: The method for manufacturing a connection structure includes: a disposition step of disposing a first circuit member and a second circuit member with a circuit connecting material interposed therebetween; and a press-bonding step of thermally press-bonding the first circuit member and the second circuit member at a predetermined temperature to obtain a connection structure. The circuit connecting material comprises a radical polymerizable compound, an organic peroxide having a 1-minute half-life temperature higher than the above predetermined temperature and equal to or lower than a temperature that is higher by 20°C than the predetermined temperature, a secondary thiol compound, and conductive particles.
申请公布号 JP2015167223(A) 申请公布日期 2015.09.24
申请号 JP20150011589 申请日期 2015.01.23
申请人 DEXERIALS CORP 发明人 TANAKA YUSUKE;HAYASHI SHINICHI;ASABA YASUHIRO
分类号 H01L21/60;C08G75/04;C09J4/00;C09J5/06;C09J11/06 主分类号 H01L21/60
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