摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a connection structure that can maintain a service life and allows low-temperature press-bonding, and a circuit connecting material.SOLUTION: The method for manufacturing a connection structure includes: a disposition step of disposing a first circuit member and a second circuit member with a circuit connecting material interposed therebetween; and a press-bonding step of thermally press-bonding the first circuit member and the second circuit member at a predetermined temperature to obtain a connection structure. The circuit connecting material comprises a radical polymerizable compound, an organic peroxide having a 1-minute half-life temperature higher than the above predetermined temperature and equal to or lower than a temperature that is higher by 20°C than the predetermined temperature, a secondary thiol compound, and conductive particles. |