发明名称 |
TIN OR TIN ALLOY ELECTROPLATING BATH AND PROCESS FOR PRODUCING BUMPS USING SAME |
摘要 |
A tin or tin alloy electroplating bath and a process for producing a bump using the same are disclosed. The electroplating bath includes an inorganic acid and an organic acid, as well as a water-soluble salt thereof; a non-ionic surfactant selected from the group consisting of polyoxyalkylene phenyl ethers, polyoxyalkylene polycyclic phenyl ethers, and salts thereof; and leveling agents containing at least one selected from the group consisting of aliphatic aldehydes, aromatic aldehydes, aliphatic ketones, and aromatic ketones; and at least one selected from the group consisting of α,β-unsaturated carboxylic acids, α,β-unsaturated carboxylic acid amides, and salts thereof. The process includes forming a coating film of a tin or tin alloy on a substrate with an electroplating bath as set forth above; and then performing reflow treatment. |
申请公布号 |
US2015267310(A1) |
申请公布日期 |
2015.09.24 |
申请号 |
US201514661450 |
申请日期 |
2015.03.18 |
申请人 |
C. Uyemura & Co., Ltd. |
发明人 |
IKUMOTO Raihei;TSUJIMOTO Masanobu;KANO Toshikazu |
分类号 |
C25D3/32;H05K3/40;C25D5/50;C25D3/60;C25D5/02 |
主分类号 |
C25D3/32 |
代理机构 |
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代理人 |
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主权项 |
1. A tin or tin alloy electroplating bath comprising:
an inorganic acid and an organic acid, as well as a water-soluble salt thereof; a non-ionic surfactant selected from the group consisting of polyoxyalkylene phenyl ethers, polyoxyalkylene polycyclic phenyl ethers, and salts thereof, wherein the phenyl or polycyclic phenyl group in the non-ionic surfactant may be substituted with C1-24 alkyl or hydroxy group; and leveling agents comprising: at least one selected from the group consisting of aliphatic aldehydes, aromatic aldehydes, aliphatic ketones, and aromatic ketones; and at least one selected from the group consisting of α,β-unsaturated carboxylic acids, α,β-unsaturated carboxylic acid amides, and salts thereof. |
地址 |
Osaka JP |