摘要 |
Provided is a method for manufacturing a semiconductor device. According to the method, a first bonding layer, a first release layer, a second bonding layer and a second release layer can be sequentially arranged between a carrier and a device wafer. All of the first bonding layer, the first release layer, the second bonding layer and the second release layer can be made of thermosetting resin. |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;KANG, UN-BYOUNG;SOHN, JOONSIK;AHN, JUNG-SEOK;LEE, CHUNGSUN;CHO, TAEJE |
发明人 |
KANG, UN-BYOUNG;SOHN, JOONSIK;AHN, JUNG-SEOK;LEE, CHUNGSUN;CHO, TAEJE |