发明名称 HONEYCOMB STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a honeycomb structure of which the honeycomb substrate is free of cracks.SOLUTION: A honeycomb structure 100 includes a honeycomb substrate 10 having a porous wall 1 for partitioning a plurality of cells 2 extending from an end face, an inflow face 11 of a fluid to another end face, an outflow face 12, and an outer peripheral coat layer 26 arranged on the outer periphery of the honeycomb substrate 10. The thermal expansion coefficient of the outer peripheral coat layer 26 is larger than that of the honeycomb substrate 10 in 25-800°C. Preferably, the ratio of the thermal expansion coefficient of the outer peripheral coat layer 26 to that of the honeycomb substrate 10 satisfies the expression: 1.1<(thermal expansion coefficient of the outer peripheral coat layer 26/thermal expansion coefficient of the honeycomb substrate 10)<40 in 25-800°C.
申请公布号 JP2015166296(A) 申请公布日期 2015.09.24
申请号 JP20140041375 申请日期 2014.03.04
申请人 NGK INSULATORS LTD 发明人 ITO MITSUHIRO
分类号 C04B41/85;B01D39/20;B01D46/00;F01N3/022 主分类号 C04B41/85
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