发明名称 ETCHING METHOD AND DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To perform etching of high anisotropy with small damage on the surface of an etched material, while ensuring a high surface accuracy, by performing the etching through chemical reaction of atoms or molecules of low energy contained in a cluster and the etched material.SOLUTION: A cluster is produced by aggregating atoms or molecules of a reaction gas capable of producing a metal complex by causing chemical reaction with an etched material. The cluster is supplied to the surface of the etched material without being ionized, thus enhancing the density of the atoms or molecules of the reaction gas on the surface. Under that state, the reaction gas and the etched material cause chemical reaction to produce a metal complex, thereby performing etching.</p>
申请公布号 JP2015167173(A) 申请公布日期 2015.09.24
申请号 JP20140041240 申请日期 2014.03.04
申请人 OSAKA UNIV 发明人 KARAHASHI KAZUHIRO;SEKI TOSHIO;MATSUO JIRO;HAMAGUCHI TOMOSHI;KINOSHITA KEIZO;MIZOTANI KOHEI
分类号 H01L21/302 主分类号 H01L21/302
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