METHOD OF MANUFACTURING WAFER LEVEL PACKAGE, WAFER LEVEL PACKAGE, AND WAFER CUTTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a wafer level package, in which occurrence of poor appearance and deterioration of optical performance can be suppressed and reduction in the number of chips to be extracted from a wafer can also be suppressed.SOLUTION: A method of manufacturing a wafer level package includes: a first step for joining a plurality of wafers by pressing a pedestal part (2) which is provided adjacent to the optical surface equipped by a wafer (1) located on the uppermost surface and the lowermost surface out of the plurality of wafers; a second step for shaving off the pedestal part (2); and a third step for separating the wafers into a plurality of wafer level packages after the second step.