发明名称 |
SIMPLIFIED ELECTRONIC MODULE FOR A SMART CARD WITH A DUAL COMMUNICATION INTERFACE |
摘要 |
An electronic module with a dual contact and contactless communication interface, has, on a first face, an electric contact terminal for contact with corresponding contacts of a smart card reader, and, on a second face, an antenna with a coil and a microelectronic chip coated with insulating resin and provided with a contactless communication interface. The antenna has a proximal connection pad and a distal connection pad to be connected to the corresponding terminals of the contactless communication interface of the chip. The proximal connection pad and distal connection pad of the antenna are arranged inside the encapsulation area by an insulating resin, in such a way as to produce a conductive bridge between each proximal connection pad or distal connection pad and the corresponding terminal of the chip, directly via connection wires between said connection pads and the corresponding terminals of the chip, without using vias. |
申请公布号 |
US2015269476(A1) |
申请公布日期 |
2015.09.24 |
申请号 |
US201314435680 |
申请日期 |
2013.10.14 |
申请人 |
SMART PACKAGING SOLUTIONS |
发明人 |
Calvas Bernard;Bousmaha Halim |
分类号 |
G06K19/077 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
1. An electronic module with a dual contact and contactless communication interface, said module comprising:
a substrate having, on a first face, an electrical contact terminal block enabling operation via contact with corresponding contacts of a smartcard reader, and, on a second face, an antenna provided with at least one turn, and a microelectronic chip protected by an encapsulation zone and provided with a contactless communication interface, said antenna comprising a proximal connection pad and a distal connection pad for connection to corresponding terminals of said contactless communication interface of the chip, wherein the two, proximal and distal connection pads of the antenna are arranged inside the encapsulation zone, and wherein an electrical connection connects each proximal or distal connection pad of the antenna to the corresponding terminal of the chip, without using vias. |
地址 |
Rousset FR |