| 摘要 |
PROBLEM TO BE SOLVED: To provide a lamination type ceramic electronic part which is configured by packaging an electronic part on a multilayer ceramic substrate so that the undulation amount of an electronic part mounting portion occurring when the multi-layer ceramic substrate is burned is reduced, so that the electronic part is stable installed in the lamination type ceramic electronic part.SOLUTION: A flat portion 4 formed of a low-temperature simultaneously burned ceramic material which is smaller in contraction coefficient than low-temperature simultaneously turned ceramic material forming a dielectric layer is provided on a principal surface of a multilayer ceramic substrate 5 which has plural laminated dielectric layers 3 and on which an electronic part 2 is mounted, or between internal layers of the multilayer ceramic substrate, and in an area containing at least a part of a mounted electrode 1 on which the electronic part is mounted when the multilayer ceramic substrate is viewed in the lamination direction. |
