LIGHT EMITTING ELEMENT UNIT AND METHOD FOR MANUFACTURING THE SAME, LIGHT EMITTING ELEMENT PACKAGE AND ILLUMINATING DEVICE

摘要

A light emitting element unit according to the present invention includes a semiconductor light emitting element that has a surface, a back surface, and a side surface, where the surface or the back surface is a light extracting surface from which light generated inside is emitted, a submount which has a bottom wall and a side wall, has a recess portion defined by the bottom wall and the side wall, and supports the semiconductor light emitting element by the bottom wall in a position in which the light extracting surface is directed upward at the recess portion, and has an inclined surface on the side wall, inclined at a predetermined angle with respect to the bottom wall so as to face the side surface of the semiconductor light emitting element, and a light reflecting film formed on the inclined surface of the submount.

主权项

1. A method for manufacturing a light emitting element unit, comprising the steps of;
forming a recess portion and, simultaneously, an inclined surface inclined at a predetermined angle with respect to a bottom wall that partitions the recess portion from the back surface side, on the recess portion side of a side wall that partitions the recess portion from the lateral side, by selectively wet-etching an Si substrate having a surface and a back surface from the surface side; forming a light reflecting film on the inclined surface; and mounting a semiconductor light emitting element which has a surface, a back surface, and a side surface, and whose surface or back surface is a light extracting surface from which light generated inside is emitted, on the bottom wall of the Si substrate so that the light extracting surface faces upward and the side surface faces the inclined surface.