发明名称 TRENCH POWER MOSFET AND MANUFACTURING METHOD THEREOF
摘要 A trench power MOSFET and a manufacturing method thereof are provided. The gate of the trench power MOSFET includes an upper doped region and a lower doped region which have different types of doping to form a PN junction. As such, when the trench power MOSFET is in operation, a junction capacitance formed at the PN junction is in series with the intrinsic gate-to-drain capacitance. Accordingly, the effective capacitance between the gate and the drain may be reduced.
申请公布号 US2015270384(A1) 申请公布日期 2015.09.24
申请号 US201514600280 申请日期 2015.01.20
申请人 SUPER GROUP SEMICONDUCTOR CO., LTD. 发明人 HSU HSIU-WEN
分类号 H01L29/78;H01L29/423;H01L29/06;H01L21/225;H01L21/265;H01L21/285;H01L21/324;H01L29/66;H01L29/10 主分类号 H01L29/78
代理机构 代理人
主权项 1. A trench power MOSFET comprising: a substrate; an epitaxial layer formed on the substrate; and a plurality of trench transistor units formed in the epitaxial layer, wherein each of the trench transistor units includes a trench gate structure comprising: a trench formed in the epitaxial layer, wherein an insulating layer is formed on an inner wall of the trench; anda gate filled in the trench, wherein the gate includes an upper doped region and a lower doped region to form a PN junction.
地址 NEW TAIPEI CITY TW