发明名称 |
TRENCH POWER MOSFET AND MANUFACTURING METHOD THEREOF |
摘要 |
A trench power MOSFET and a manufacturing method thereof are provided. The gate of the trench power MOSFET includes an upper doped region and a lower doped region which have different types of doping to form a PN junction. As such, when the trench power MOSFET is in operation, a junction capacitance formed at the PN junction is in series with the intrinsic gate-to-drain capacitance. Accordingly, the effective capacitance between the gate and the drain may be reduced. |
申请公布号 |
US2015270384(A1) |
申请公布日期 |
2015.09.24 |
申请号 |
US201514600280 |
申请日期 |
2015.01.20 |
申请人 |
SUPER GROUP SEMICONDUCTOR CO., LTD. |
发明人 |
HSU HSIU-WEN |
分类号 |
H01L29/78;H01L29/423;H01L29/06;H01L21/225;H01L21/265;H01L21/285;H01L21/324;H01L29/66;H01L29/10 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
1. A trench power MOSFET comprising:
a substrate; an epitaxial layer formed on the substrate; and a plurality of trench transistor units formed in the epitaxial layer, wherein each of the trench transistor units includes a trench gate structure comprising:
a trench formed in the epitaxial layer, wherein an insulating layer is formed on an inner wall of the trench; anda gate filled in the trench, wherein the gate includes an upper doped region and a lower doped region to form a PN junction. |
地址 |
NEW TAIPEI CITY TW |