| 发明名称 |
ELECTROLESS PLATING METHOD |
| 摘要 |
An electroless plating method which can prevent stoppage of a plating reaction and a decrease in a plating rate is disclosed. This method includes: circulating a plating solution through a plating bath while heating the plating solution; immersing the substrate in the plating solution in the plating bath; forming a first electroless plating film on the substrate while circulating the plating solution at a first flow rate during a period from when the substrate is immersed in the plating solution until a predetermined time elapses; and forming a second electroless plating film on the first electroless plating film while circulating the plating solution at a second flow rate that is lower than the first flow rate after the predetermined time has elapsed. |
| 申请公布号 |
US2015267302(A1) |
申请公布日期 |
2015.09.24 |
| 申请号 |
US201514658616 |
申请日期 |
2015.03.16 |
| 申请人 |
Ebara Corporation |
发明人 |
Kubota Makoto;Susaki Akira;Shimoyama Masashi;Nakada Tsutomu |
| 分类号 |
C23C22/73 |
主分类号 |
C23C22/73 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electroless plating method for plating a substrate, comprising:
circulating a plating solution through a plating bath while heating the plating solution; immersing the substrate in the plating solution in the plating bath; forming a first electroless plating film on the substrate while circulating the plating solution at a first flow rate during a period from when the substrate is immersed in the plating solution until a predetermined time elapses; and forming a second electroless plating film on the first electroless plating film while circulating the plating solution at a second flow rate that is lower than the first flow rate after the predetermined time has elapsed. |
| 地址 |
Tokyo JP |
