MEMS Structures and Methods for Forming the Same

摘要

A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer

主权项

1. A device comprising:
a substrate; a micro-electro-mechanical system (MEMS) device over the substrate, wherein the MEMS device comprises:
a movable element as a first capacitor plate of a capacitor; anda fixed element as a second capacitor plate of the capacitor; a bond ring encircling the MEMS device, wherein the bond ring comprises a metal; and a protection layer over the bond ring, wherein the protection layer is capable of forming a eutectic metal with the bond ring.