| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package capable of preventing displacement of a semiconductor chip in sealing the semiconductor chip with a resin, and a method of manufacturing the same.SOLUTION: The semiconductor package has: a semiconductor chip; a resin part which seals a side surface of the semiconductor chip; and a wiring structure which is formed on one surface of the resin part and on a circuit formation surface of the semiconductor chip and includes an insulating layer and a wiring layer. The resin part includes a structure in which a second resin part superior to a first resin part in adhesion to the insulating layer is laminated on the first resin part. The second resin part is in contact with the insulating layer. The circuit formation surface of the semiconductor chip is located at a position recessed from a surface of the second resin part, is exposed from the second resin part, and is covered with the insulating layer. Via wiring is formed in the insulating layer and is directly connected to an electrode pad of the circuit formation surface. |
