发明名称 加工装置
摘要 PROBLEM TO BE SOLVED: To provide a machining device capable of reducing a size thereof and improving a machining efficiency.SOLUTION: The machining device includes: a first machining space; second and third machining spaces disposed across the first machining space; a first machining unit machining a workpiece in the first machining space; a second machining unit movable between the second and third machining spaces, and machining the workpiece in the machining spaces; a first workpiece holder movable between the first and second machining spaces; a second workpiece holder movable between the first and third machining spaces; and control means for controlling the first and second workpiece holders so that the workpieces of the first and second workpiece holders move to the second or third machining space to be machined after being machined in the first machining space, and so that when one workpiece holder is placed in the first machining space and the workpiece thereof is being machined, the other workpiece holder is placed in the second or third machining space and the workpiece thereof is machined.
申请公布号 JP5782373(B2) 申请公布日期 2015.09.24
申请号 JP20110273816 申请日期 2011.12.14
申请人 株式会社 神崎高級工機製作所;アイシン精機株式会社 发明人 檜垣 雅男;グェン スアントイ;磯貝 敏之;宮原 恭吾;松久 和也
分类号 B23P23/00;B23Q39/04;B25J13/00 主分类号 B23P23/00
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